Method for precision assembly of integrated circuit chip packages

ABSTRACT

An electronic dive and method of fabricating an electronic device. The method including placing a placement guide over a top surface of a module substrate, the placement guide having a guide opening, the guide opening extending from a top surface of the placement guide to a bottom surface of the placement guide; aligning the placement guide to an integrated circuit chip position on the module substrate; fixing the placement guide to the module substrate; placing an integrated circuit chip in the guide opening, sidewalls of the placement guide opening constraining electrically conductive bonding structures on bottom surface of the integrated circuit chip to self-align to an electrically conductive module substrate contact pad on the top surface of the module substrate in the integrated circuit chip position; and bonding the bonding structures to the module substrate contact pads, the bonding structures and the module substrate contact pads in direct physical and electrical contact after the bonding.

This invention was made with Government support under Contract No.:H98230-04-C-0920, NBCH3039004 awarded by DARPA. The Government hascertain rights in this invention.

FIELD OF THE INVENTION

The present invention relates to the field of integrated circuitpackaging; more specifically, it relates to method and apparatus forprecision assembly of integrated circuit packages.

BACKGROUND OF THE INVENTION

Integrated circuit chips are mounted to modules that provide fan out ofthe interconnections for the next level of assembly. As the size of theinterconnections of the integrated circuit chip decrease and the densityincreases, it becomes more difficult to align the chip pads to themodule substrate pads and keep them aligned during the subsequentattachment processes. This problem becomes more difficult when theweight of the integrated circuit chips decrease. Present solutions arecostly and time-consuming. Therefore, there is an ongoing need for amethod of precision attachment of integrated circuit chips to modules.

SUMMARY OF THE INVENTION

A first aspect of the present invention is a method of fabricating anelectronic device, comprising: placing a placement guide over a topsurface of a module substrate, a bottom surface of the placement guidefacing a top surface of the module substrate, the placement guide havingone or more guide openings, the guide openings extending from a topsurface of the placement guide to the bottom surface of the placementguide; aligning the placement guide to at least one integrated circuitchip position of one or more integrated circuit chip positions on themodule substrate; fixing the aligned placement guide to the modulesubstrate; placing one or more integrated circuit chips in correspondingguide openings of the one or more guide openings, bottom surfaces of theone or more integrated circuit chips facing the top surface of themodule substrate, for each of the placed integrated circuit chips,sidewalls of the corresponding placement guide openings constrainingelectrically conductive bonding structures on bottom surfaces of theplaced one or more integrated circuit chips to self-align tocorresponding electrically conductive module substrate contact pads onthe top surface of the module substrate at corresponding integratedcircuit chip positions of the one or more integrated circuit chippositions; and bonding the bonding structures to the module substratecontact pads, the bonding structures and the module substrate contactpads in direct physical and electrical contact after the bonding.

A second aspect of the present invention is an electronic device,comprising a placement guide fixed to a top surface of a modulesubstrate, the placement guide having a guide opening, the guide openingextending from a top surface of the placement guide to a bottom surfaceof the placement guide; and an integrated circuit chip in the guideopening, bonding structures on a bottom surface the integrated circuitchip in direct physical and electrical contact with corresponding modulesubstrate contact pads on the top surface of the module substrate, awidth of the guide opening equal to a corresponding width of theintegrated circuit chip plus one half or less a first distance betweencenters of a first pair of adjacent module substrate contact pads of themodule substrate contact pads in a widthwise direction and a length ofthe guide opening equal to a corresponding length of the integratedcircuit chip plus one half or less a second distance between centers ofa second pair of adjacent module substrate contact pads of the modulesubstrate contact pads in a lengthwise direction.

BRIEF DESCRIPTION OF DRAWINGS

The features of the invention are set forth in the appended claims. Theinvention itself, however, will be best understood by reference to thefollowing detailed description of an illustrative embodiment when readin conjunction with the accompanying drawings, wherein:

FIG. 1A is a top view and FIG. 1B is a cross-section through line 1B-1Bof FIG. 1A illustrating a precision integrated circuit chip placementguide according to embodiments of the present invention;

FIG. 2A is a top view and FIG. 2B is a cross-section through line 2B-2Bof FIG. 2A illustrating a precision integrated circuit chip modulesubstrate according to embodiments of the present invention;

FIGS. 3 through 7 are cross-sectional views through line 1B-1B of FIG.1A and line 2B-2B of FIG. 2A illustrating fabrication of precisionaligned integrated circuit modules according to a first embodiment ofthe present invention;

FIGS. 8 through 12 are cross-sectional views through line 1B-1B of FIG.1A and line 2B-2B of FIG. 2A illustrating fabrication of precisionaligned integrated circuit modules according to a second embodiment ofthe present invention;

FIGS. 13 through 17 are cross-sectional views through line 1B-1B of FIG.1A and line 2B-2B of FIG. 2A illustrating fabrication of precisionaligned integrated circuit modules according to a third embodiment ofthe present invention;

FIG. 18 is cross-section of an integrated circuit guide, an integratedcircuit chip and an integrated circuit module assembly illustrating thealignment tolerances of the chip to the module substrate according tothe embodiments of the present invention;

FIGS. 19A through 19D are cross-sectional views illustrating details ofthe edges integrated circuit placement guides and integrated circuitchips according to embodiments of the present invention;

FIG. 20 is a cross-section of an exemplary integrated circuit chipmounted to an exemplary integrated circuit module according toembodiments of the present invention;

FIG. 21 is a cross-section of an integrated circuit chip and anintegrated circuit module assembly utilizing a handle substrate; and

FIG. 22 is a flowchart of the methodology of fabricating precisionaligned integrated circuit modules according to embodiments of thepresent invention.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1A is a top view and FIG. 1B is a cross-section through line 1B-1Bof FIG. 1A illustrating a precision integrated circuit chip placementguide according to embodiments of the present invention. In FIGS. 1A and1B, a placement guide 100 includes a multiplicity of through guideopenings 105 extending from a top surface 107 to a bottom surface 108 ofthe guide. Top and bottom surfaces 107 and 108 are parallel to eachother. Through holes have a length G1 and a width G2. Placement guide100 has a thickness H1. The values of G1, G2 and H1 are chosen based onthe dimensions of the integrated circuit chips that will be placedwithin guide openings 105 as described infra. Guide openings 105 may beformed using a photolithographic process in combination with wet etchingor reactive ion etching (RIE). In one example, guide openings 105 areformed by a deep RIE process. A deep RIE process is an RIE processdesigned to etch deep opening (e.g. greater than 10 microns) withsubstantially straight sidewalls relative to top and bottom surfaces 107and 108 of placement guide 100. Following a process known in the art asthe “Bosch Process”, a deep RIE processes alternates, up to severaltimes per minute, in situ, between a first process that etches thesubstrate and a second process that forms polymer on the sidewalls ofthe opening being etched. After etching is complete, the polymer may beremoved with a plasma ash. Placement guide surfaces may be coated withan oxide or a nitride.

Placement guide 100 may advantageously be fabricated from the samematerial as the substrate used in the fabrication of the integratedcircuit chips that will be placed within guide openings 105. In oneexample, placement guide 100 is fabricated from silicon. In one example,placement guide 100 comprises a silicon disk. In one example H1 isbetween about 25 microns and about 800 microns.

While a regular pattern of identically sized opening 105 are illustratedin FIG. 1A, different guide openings 105 may be of different sizes(length, width or both length and width) to accommodate different sizeintegrated circuit chips.

Placement guide 100 may include alignment aids as is known in the art.In FIGS. 1A and 1B, placement guide 100 is illustrated with exemplaryalignment holes 109 that will mate with alignment pins as describedinfra. Alignment holes 109 are formed at the same time as guide openings105 and are defined on the same photomask. Alternatively, alignmentholes 109 may be visually aligned to alignment targets as describedinfra.

FIG. 2A is a top view and FIG. 2B is a cross-section through line 2B-2Bof FIG. 2A illustrating a precision integrated circuit chip modulesubstrate according to embodiments of the present invention. In FIGS. 2Aand 2B, a module substrate 110 includes a multiplicity of integratedcircuit chip positions 115 having electrically conductive modulesubstrate contact pads 120. Integrated circuit chip positions 115 arepositions on module substrate 110 where integrated circuit chips will beelectrically bonded. Module substrate 110 includes a substrate layer 125containing electrically conductive pins 130 and an interconnect layer135 containing wires 140. Wires 140 electrically connect modulesubstrate contact pads 120 to pins 130. In one example, module substratecontact pads 120 comprise copper, tungsten, tantalum, aluminum orcombinations thereof. Interconnect layer 135 may contain two or moreinterconnected wiring levels 125. Details of substrate layer 125 andinterconnect layer 135 are described infra in relationship to FIG. 20.Module substrate 110 has a thickness H2.

Module substrate 110 may comprise silicon wafers having one or morewiring levels, ceramic substrates having one or more wiring levels ororganic substrates (i.e. printed circuit boards, flexible circuitboards, fiberglass circuit boards, plastic boards) having one or morewiring levels. Module substrate 110, though illustrated with front tobackside connections may have frontside contact pads instead of pins130. In one example, pins 130 may extend past the backside of modulesubstrate 110. In one example, pins 130 may have copper or solder ballsfixed thereto for attachment to module sockets.

Module substrate 110 may advantageously be fabricated from the samematerial as the substrate used in the fabrication of the integratedcircuit chips that will be placed within guide openings 105 of placementguide 100 (see FIGS. 1A and 1B). In one example, module substrate 110 isfabricated from silicon. In one example, module substrate 110 comprisesa silicon disk. In one example H2 is between about 25 microns and about800 microns. Module substrate 110 may advantageously be fabricated usingthe same processes used to fabricate integrated circuit chips.

Module substrate 110 may include alignment aids as is known in the art.In FIGS. 2A and 2B, module substrate 110 is illustrated with exemplaryalignment pins 142 that will mate with alignment holes 109 (see FIGS. 1Aand 1B). Alternatively, instead of alignment pins, module substrate 110may include alignment targets that may be aligned to alignment marks onalignment guide 100 or through holes in alignment guide 100 (see FIGS.1A and 1B) and which may be held in place by clamping or adhesive oralternate method known in the art. In FIG. 2B, integrated circuit chippositions 115 include plateaus 143 separated by recessed regions 144 ofinterconnect layer 135.

FIGS. 3 through 7 are cross-sectional views through line 1B-1B of FIG.1A and line 2B-2B of FIG. 2A illustrating fabrication of precisionaligned integrated circuit modules according to a first embodiment ofthe present invention. In FIG. 3, placement guide 100 is aligned overmodule substrate 110 so guide openings 105 are precision aligned overintegrated circuit chip positions 115. Precision alignment of placementguide 100 to module substrate 110 is described infra in reference toFIG. 18. Since there are a variety of alignment methodologies known inthe art that may be used, no alignment structures are illustrated inFIG. 3. Alignment schemes that may be used to align placement guide 100to module substrate 110 include, but are not limited to, using alignmenttargets and marks with visual or infrared optics in combination withprecision tooling and/or image recognition software for optimization ofX, Y and rotational alignment. After alignment, placement guide 100 ispermanently or removeably attached (fixed) to module substrate 110 usingany number of schemes known in the art, including, but not limited to,mechanical clamping with and without alignment pins and adhesiveattachment with and without alignment pins.

In FIG. 4, integrated circuit chips 145 having electrical/mechanicalbonding structures 150 are placed into openings 105 (see FIG. 3).Examples of bonding structures include, but are not limited to, metalpads, copper pads and solder bumps. Bonding structures 150 self-align tomodule substrate contact pads 120 (see, for example, FIG. 20) because ofthe precision alignment of placement guide 100 to module substrate 110and the size of guide openings 105 (see FIG. 3). Next, anelectromechanical bond between module substrate contact pads 120 andbonding structures 150 is formed. An optional weight 152 may be placedover integrated circuit chips 145 to aid in the bonding process. Whenbonding structures are solder bumps, the assembly may be heated toreflow the solder bumps in a inert or reducing gas such as nitrogen ornitrogen and hydrogen mixture, respectively to minimize solder or padoxidation. An optional fluxing gas such as formic acid may be added tothe inert or reducing gas used during reflow to enhance joining. Whenthe bonding structures and module substrate contact pads includeterminal layers of copper, a copper to copper weld may be formed, forexample, by heating the assembly to between about 350° C. and about 450°C. under about 100 pounds per square inch of pressure in the presence ofan inert gas (i.e. nitrogen, argon or helium) or and inert gas (i.e.,nitrogen, argon or helium)/reducing gas (i.e, hydrogen) mixture. Whenthe bonding structures and module substrate contact pads includeterminal layers of gold, a gold to gold weld may be formed, for example,by heating the assembly to between about 350° C. and about 450° C. underabout 100 pounds per square inch of pressure in the presence of air oran inert gas, or with the aide of an ultrasonic bonding force. Theformer solder and gold bonding processes are also known in the art as achip attaching process, simply chip attach, reflow, assembly orultrasonic bonding.

In FIG. 5, placement guide 100 (see FIG. 4) is removed and in FIG. 6,module substrate 110 (see FIG. 5) is singulated (i.e. by mechanicaldicing, laser dicing, wet etching, RIE, or mechanical fracturing) intoindividual modules 155 each including a single integrated circuit chip145.

Alternatively, placement guide 100 (see FIG. 4) is not removed and inFIG. 7, module substrate 110 (see FIG. 5) is singulated (i.e. bymechanical dicing, laser dicing, wet etching, RIE, or mechanicalfracturing) into individual modules 155 each including a singleintegrated circuit chip 145 surrounded by a portion of placement guide10A. In the case placement guide 100 (see FIG. 3) is not removed, allexposed surfaces of the placement guide and exposed interconnections maybe coated with a dielectric film, covered by a dielectric layer or allexposed interconnections encapsulated with an adhesive/sealant such asis known in the art as “chip underfill” or “wafer to wafer bondingadhesive”. The encapsulation may enhance module substrate mechanicalproperties and minimize interconnection corrosion or degradation. Thus,direct physical contact between integrated circuit chip 145 and portionof placement guide 100A will not result in electrical shorting of theintegrated circuit chip to the placement guide or of the placement guideto the module substrate and the assembly can achieve improvedmanufacturability/handling and product or application reliability.

FIGS. 8 through 12 are cross-sectional views through line 1B-1B of FIG.1A and line 2B-2B of FIG. 2A illustrating fabrication of precisionaligned integrated circuit modules according to a second embodiment ofthe present invention. FIGS. 8, 9 and 10 are similar to respective FIGS.3, 4 and 5 except in FIGS. 8, 9 and 10, integrated circuit chippositions 115 are designed to interconnect to more than one integratedcircuit chip 145. However, each integrated circuit chip 145 is stillwithin a guide opening 105.

In FIG. 1, module substrate 110 (see FIG. 10) is singulated (i.e. bymechanical dicing, laser dicing, wet etching, RIE, or mechanicalfracturing) into individual modules 155 each including a two or moreintegrated circuit chips 145.

Alternatively, placement guide 100 (see FIG. 9) is not removed and inFIG. 12, module substrate 110 (see FIG. 10) is singulated (i.e. bymechanical dicing, laser dicing, wet etching, RIE, or mechanicalfracturing) into individual modules 155 each including two or moreintegrated circuit chips 145, each chip surrounded by and separated fromeach other by a portion of placement guide 10A.

FIGS. 13 through 17 are cross-sectional views through line 1B-1B of FIG.1A and line 2B-2B of FIG. 2A illustrating fabrication of precisionaligned integrated circuit modules according to a third embodiment ofthe present invention. FIG. 13 is the same as FIG. 3 and FIGS. 14 and 15are similar to respective FIGS. 4 and 5 except in FIGS. 14 and 15,integrated circuit chips 145A are thinner than integrated circuit chips145 of FIG. 5 and thus do not extend above top surface 107 of placementguide 100 (see FIG. 14). Therefore, optional weight 152 includesprotruding regions 162 extending into guide opening 105 (see FIG. 13)and contacting integrated circuit chips 145.

In FIG. 16, module substrate 110 (see FIG. 15) is singulated (i.e. bymechanical dicing, laser dicing, wet etching, RIE, or mechanicalfracturing) into individual modules 155 each including a two or moreintegrated circuit chips 145.

Alternatively, placement guide 100 (see FIG. 14) is not removed and inFIG. 17, module substrate 110 (see FIG. 15) is singulated (i.e. bymechanical dicing, laser dicing, wet etching, RIE, or mechanicalfracturing) into individual modules 155 each including one integratedcircuit chip 145 surrounded by and separated from each other by aportion of placement guide 10A.

Other embodiments of the present invention include, mounting two or morethin chips on the same module substrate, mounting a combination of thickand thin chips on the same module substrate, mounting different (width,length or both width and length) sized chips on the same modulesubstrate, and mounting one or more stacked chips on the same modulesubstrate and combinations thereof.

FIG. 18 is cross-section of an integrated circuit guide, an integratedcircuit chip and an integrated circuit module assembly illustrating thealignment tolerances of the chip to the module according to theembodiments of the present invention. In FIG. 18, bonding structures 150and module substrate contact pads 120 have a pitch P. Sidewalls 163 ofintegrated circuit chip 145 are separated from opposing sidewalls 164 ofplacement guide 100 by a distance T. In one example, T is equal or lessthan 0.5*P. If the opposing sidewalls are not parallel to each other,then T is the value of the smallest distance between the opposingsidewalls (see for example, FIG. 19B). Note, the pitch P for differentintegrated circuit chip positions 115 (see FIG. 2A) can be different. Ifan integrated circuit chip has a length C1 and a width C2, then(referring to FIG. 1A), G1 is less than or equal to C1+0.5*P and G2 isless than or equal to C2+0.5*P. It should be understood that there aretwo pitches in a rectangular integrated circuit, a pitch in thewidthwise direction and a pitch in the lengthwise direction. Thesepitches may or may not be the same. Thus, the distance T in thewidthwise (T_(W)) direction may be different from the distance T in thelengthwise direction (T_(L)). Alternatively, the smaller value of T_(W)and T_(L) may be used in both the lengthwise and widthwise directions.

FIGS. 19A through 19D are cross-sectional views illustrating details ofthe edges integrated circuit placement guides and integrated circuitchips according to embodiments of the present invention. In FIG. 19A,the corner formed by top surface 107 and top edge of sidewall 164 ofplacement guide 100 has been chamfered. In FIG. 19B, the entire sidewall164 from top surface 107 to bottom surface 108 of placement guide 100 istapered at an angle α A first distance (T) from the edge formed bysidewall 164 and bottom surface 108 to sidewall 163 being smaller than asecond distance from the edge formed by sidewall 164 and top surface 107to sidewall 163. In one example a is between about 1° and about 9°. Inanother example a is between about 1° and about 45°.

In FIG. 19C, the entire sidewall 164 from top surface 107 to bottomsurface 108 of placement guide 100 is tapered at an angle β measuredbetween sidewall 164 and bottom surface 108. The entire sidewall 163 ofintegrated circuit chip 145 is likewise tapered at the angle β, however,sidewalls 163 and 164 are parallel and spaced distance T apart. In oneexample β is between about 1° and about 45°. Because integrated circuitchip 145 overlays placement guide 100 the placement guide cannot beremoved from module substrate 110.

In FIG. 19D, the entire sidewall 164 from top surface 107 to bottomsurface 108 of placement guide 100 is tapered at an angle β measuredbetween sidewall 164 and top surface 107. The entire sidewall 163 ofintegrated circuit chip 145 is likewise tapered at the angle β, however,sidewalls 163 and 164 are parallel and spaced distance T apart. Becauseplacement guide 100 overlays integrated circuit chip 145 the integratedcircuit chip must be placed on module substrate 110 before the placementguide is placed on the module substrate.

While only one edge of placement guide 100 and one edge of integratedcircuit chip 145 have been illustrated in FIGS. 19A, 19B, 19C and 19D,it should be recognized that all edges of the placement guide and alledges of the integrated circuits may be the same as the single edgesillustrated in FIGS. 19A, 19B, 19C and 19D.

FIG. 20 is a cross-section of an exemplary integrated circuit chipmounted to an exemplary integrated circuit module according toembodiments of the present invention. In FIG. 20, interconnect layer 135of module substrate 110 includes first, second and third dielectriclayers 165A, 165B and 165C containing respective damascene wires andvias 170A, 170B and 170C. Wires 170A, 170B and 170C electrically connectmodule substrate contact pads 120 to electrically conductive pins 130 insubstrate layer 125. Pins 130 are isolated from each other and fromsubstrate layer 125 by dielectric layers 180 and 185. In FIG. 20,bonding structures 150 include chip contact pads 172 on which solderbumps 173 (or solder balls) have been formed. In one example solderbumps comprise a mixture of lead and tin. Chip contact pads 120 maycomprise layers of chrome, gold, nickel, copper, tungsten, tantalum,titanium, and aluminum. A common name for these layers is ball-limitingmetallurgy (BLM). This structure produces a solder connection, also knowas a controlled-chip-collapse-connection (C4). Alternatively, bondingstructures 150 may consist only of chip contact pads 172, both the chipcontact pads and module substrate contact pads 120 having at least outerlayers of copper. This structure produces a copper-to-copper bond.Alternatively, bonding structures 150 may consist only of chip contactpads 172, both the chip contact pads and module substrate contact pads120 having at least outer layers of gold where the structure produces agold-to-gold bond.

FIG. 21 is a cross-section of an integrated circuit chip and anintegrated circuit module assembly utilizing a handle substrate 190. Incases where module substrate 110 is thin and fragile, handle substrate190 is temporarily attached to substrate layer 125 by an adhesive 195 inorder to prevent breakage of the module substrate during aligning,clamping, singulation and bonding processes.

FIG. 22 is a flowchart of the methodology of fabricating precisionaligned integrated circuit modules according to embodiments of thepresent invention. In step 200, a handle substrate is optionallyattached to a module substrate. After step 200 the method can proceedthrough either steps 205, 210 and 215 or through steps 220, 225 and 230.

In step 205, a placement guide is aligned to a module substrate and instep 210 the module substrate and placement guide are temporarily(clamped/glued) or permanently (glued or bonded) attached so as not tobe able to move during the integrated circuit chip to module substratebonding operation of step 235. In step 215, the integrated circuit chipsare placed the guide openings of the placement guide. The method thencontinues with step 235.

In step 220, the integrated circuit chips are placed on a modulesubstrate and in step 225 a placement guide is placed on the modulesubstrate, the guide openings are rough-aligned to the integratedcircuit chips and fine aligned to the module substrate. In step 230, themodule substrate and placement guide are temporarily (clamped/glued) orpermanently (glued or bonded) attached so as not to be able to moveduring the integrated circuit chip to module substrate bonding operationof step 235. The method then continues with step 235.

In step 235, the integrated circuits are bonded to the module substrate.For copper-to-copper bonding, heat and pressure are applied under aninert or inert/reducing atmosphere. For solder bump connections, heat isapplied to reflow the solder bumps (optionally under an inert orinert/reducing atmosphere). For solder bump attachment, flux may or maynot be applied prior to or after placing the integrated circuit chip onthe module substrate or during joining. Depending on flux, the assemblymay require post assembly cleaning. No clean fluxes may be deployed orcontrolled ambient gas during joining to enhance joining withoutpost-assembly cleaning.

In step 240, the placement guide is optionally removed and in step 245the module substrate is singulated into single-chip, multi-chip or bothsingle and multi-chip module substrates. In step 250, the handlesubstrate may optionally be removed. Optional testing may be performedimmediately after steps 235, 245 and 250.

Thus, the embodiments of the present invention provide methods ofprecision attachment of integrated circuit chips to module substrates.

The description of the embodiments of the present invention is givenabove for the understanding of the present invention. It will beunderstood that the invention is not limited to the particularembodiments described herein, but is capable of various modifications,rearrangements and substitutions as will now become apparent to thoseskilled in the art without departing from the scope of the invention.Therefore, it is intended that the following claims cover all suchmodifications and changes as fall within the true spirit and scope ofthe invention.

1. A method of fabricating an electronic device, comprising: placing aplacement guide over a top surface of a module substrate, a bottomsurface of said placement guide facing a top surface of said modulesubstrate, said placement guide having one or more guide openings, saidguide openings extending from a top surface of said placement guide tosaid bottom surface of said placement guide; aligning said placementguide to at least one integrated circuit chip position of one or moreintegrated circuit chip positions on said module substrate; fixing saidaligned placement guide to said module substrate; placing one or moreintegrated circuit chips in corresponding guide openings of said one ormore guide openings, bottom surfaces of said one or more integratedcircuit chips facing said top surface of said module substrate, for eachof said placed integrated circuit chips, sidewalls of said correspondingplacement guide openings constraining electrically conductive bondingstructures on bottom surfaces of said placed one or more integratedcircuit chips to self-align to corresponding electrically conductivemodule substrate contact pads on said top surface of said modulesubstrate at corresponding integrated circuit chip positions of said oneor more integrated circuit chip positions; bonding said bondingstructures to said module substrate contact pads, said bondingstructures and said module substrate contact pads in direct physical andelectrical contact after said bonding; and after said bonding, removingsaid placement guide from said module substrate.
 2. The method of claim1, wherein said bonding structures are solder bumps on chip contact padsand said bonding creates a soldered connection between said chip contactpads and said module substrate contact pads.
 3. The method of claim 1,wherein said bonding structures comprise copper chip contact pads, saidmodule substrate contact pads comprise copper and said bonding creates acopper to copper weld between said chip contact pads and said modulesubstrate contact pads.
 4. The method of claim 1, wherein said placementguide comprises silicon, said integrated circuit chip comprises silicon,and said module substrate comprises silicon.
 5. The method of claim 1,further including: attaching a handle substrate to a bottom surface ofsaid module substrate.
 6. The method of claim 1, wherein correspondingcenter to center spacing of adjacent module substrate contact pads of atleast two of said one or more integrated circuit chip positions isdifferent.
 7. The method of claim 1, wherein said integrated circuitchip is placed on said module substrate after said aligning and fixingsaid placement guide to said module substrate.
 8. The method of claim 1,further including: singulating said module substrate into individualmodules, each module substrate containing one or more integrated circuitchips.
 9. The method of claim 1, wherein at least one of said one ormore integrated circuit chips includes an additional integrated circuitchip stacked on top of and electrically connected to said at least oneof said one or more integrated circuit chips.
 10. The method of claim 1,wherein a distance between at least one sidewall of each of said one ormore placement guide openings and at least one opposing sidewall ofcorresponding placed integrated circuit chips is equal to less than onehalf a distance between centers of a pair of adjacent module substratecontact pads of said module substrate contact pads at each of saidcorresponding integrated circuit chip positions.
 11. The method of claim1, wherein said placing said integrated circuit chip on said modulesubstrate is performed before said aligning and fixing said placementguide to said module substrate.
 12. The method of claim 1, furtherincluding: after said removing said placement guide, singulating saidmodule substrate into individual modules, each module containing one ormore integrated circuit chips.
 13. A method of fabricating an electronicdevice, comprising: placing a placement guide over a top surface of amodule substrate, a bottom surface of said placement guide facing a topsurface of said module substrate, said placement guide having one ormore guide openings, said guide openings extending from a top surface ofsaid placement guide to said bottom surface of said placement guide;aligning said placement guide to at least one integrated circuit chipposition of one or more integrated circuit chip positions on said modulesubstrate; fixing said aligned placement guide to said module substrate;placing one or more integrated circuit chips in corresponding guideopenings of said one or more guide openings, bottom surfaces of said oneor more integrated circuit chips facing said top surface of said modulesubstrate, for each of said placed integrated circuit chips, sidewallsof said corresponding placement guide openings constraining electricallyconductive bonding structures on bottom surfaces of said placed one ormore integrated circuit chips to self-align to correspondingelectrically conductive module substrate contact pads on said topsurface of said module substrate at corresponding integrated circuitchip positions of said one or more integrated circuit chip positions;bonding said bonding structures to said module substrate contact pads,said bonding structures and said module substrate contact pads in directphysical and electrical contact after said bonding; and wherein adistance between at least one sidewall of each of said one or moreplacement guide openings and at least one opposing sidewall ofcorresponding placed integrated circuit chips is equal to less than onehalf a distance between centers of a pair of adjacent module substratecontact pads of said module substrate contact pads at each of saidcorresponding integrated circuit chip positions.
 14. A method offabricating an electronic device, comprising: placing a placement guideover a top surface of a module substrate, a bottom surface of saidplacement guide facing a top surface of said module substrate, saidplacement guide having one or more guide openings, said guide openingsextending from a top surface of said placement guide to said bottomsurface of said placement guide; aligning said placement guide to atleast one integrated circuit chip position of one or more integratedcircuit chip positions on said module substrate; fixing said alignedplacement guide to said module substrate; placing one or more integratedcircuit chips in corresponding guide openings of said one or more guideopenings, bottom surfaces of said one or more integrated circuit chipsfacing said top surface of said module substrate, for each of saidplaced integrated circuit chips, sidewalls of said correspondingplacement guide openings constraining electrically conductive bondingstructures on bottom surfaces of said placed one or more integratedcircuit chips to self-align to corresponding electrically conductivemodule substrate contact pads on said top surface of said modulesubstrate at corresponding integrated circuit chip positions of said oneor more integrated circuit chip positions; bonding said bondingstructures to said module substrate contact pads, said bondingstructures and said module substrate contact pads in direct physical andelectrical contact after said bonding; and wherein said placing saidintegrated circuit chip on said module substrate is performed beforesaid aligning and fixing said placement guide to said module substrate.15. A method of fabricating an electronic device, comprising: placing aplacement guide over a top surface of a module substrate, a bottomsurface of said placement guide facing a top surface of said modulesubstrate, said placement guide having one or more guide openings, saidguide openings extending from a top surface of said placement guide tosaid bottom surface of said placement guide; aligning said placementguide to at least one integrated circuit chip position of one or moreintegrated circuit chip positions on said module substrate; fixing saidaligned placement guide to said module substrate; placing one or moreintegrated circuit chips in corresponding guide openings of said one ormore guide openings, bottom surfaces of said one or more integratedcircuit chips facing said top surface of said module substrate, for eachof said placed integrated circuit chips, sidewalls of said correspondingplacement guide openings constraining electrically conductive bondingstructures on bottom surfaces of said placed one or more integratedcircuit chips to self-align to corresponding electrically conductivemodule substrate contact pads on said top surface of said modulesubstrate at corresponding integrated circuit chip positions of said oneor more integrated circuit chip positions; bonding said bondingstructures to said module substrate contact pads, said bondingstructures and said module substrate contact pads in direct physical andelectrical contact after said bonding; after said bonding, removing saidplacement guide from said module substrate; and after said removing saidplacement guide, singulating said module substrate into individualmodules, each module containing one or more integrated circuit chips.16. An electronic device, comprising: a placement guide fixed to a topsurface of a module substrate, said placement guide having a guideopening, said guide opening extending from a top surface of saidplacement guide to a bottom surface of said placement guide; and anintegrated circuit chip in said guide opening, bonding structures on abottom surface said integrated circuit chip in direct physical andelectrical contact with corresponding module substrate contact pads onsaid top surface of said module substrate, a width of said guide openingequal to a corresponding width of said integrated circuit chip plus onehalf or less a first distance between centers of a first pair ofadjacent module substrate contact pads of said module substrate contactpads in a widthwise direction and a length of said guide opening equalto a corresponding length of said integrated circuit chip plus one halfor less a second distance between centers of a second pair of adjacentmodule substrate contact pads of said module substrate contact pads in alengthwise direction.
 17. The device of claim 16, wherein said bondingstructures are solder bumps on chip contact pads and said chip pads aresoldered to said module substrate contact pads.
 18. The device of claim16, wherein said bonding structures comprise copper or gold chip contactpads, said module substrate contact pads comprise copper or gold andsaid chip contact pads and said module substrate contact pads are bondedto each other by a copper to copper weld or form gold to gold bonds. 19.The device of claim 16, wherein said placement guide comprises silicon,said integrated circuit chip comprises silicon, and said modulesubstrate comprises silicon.
 20. The device of claim 16, furtherincluding: an additional integrated circuit chip stacked on top of andelectrically connected to said integrated circuit chip.
 21. The deviceof claim 16, further including: an additional guide opening in saidplacement guide; and an additional integrated circuit chip in saidadditional guide opening, bonding structures on a bottom surface of saidadditional integrated circuit chip in direct physical and electricalcontact with corresponding additional module substrate contact pads onsaid top surface of said module substrate.
 22. The device of claim 16,wherein sidewalls of said integrated circuit chip and sidewalls said oneor more additional integrated circuit chips are separated from eachother by an unbroken region of said placement guide.